ELECTRON BEAM EVAPORATION

In electron beam evaporation, a filament emits a magnetically focused high energy beam of electrons which is swept within a crucible of deposition material. Large capacity pockets and multi-pocket indexing designs allow greater film thickness and an increase in process runs before breaking vacuum to load material.

High melting point materials can be deposited at high deposition rates making this a preferred process for refractory metal and ceramic films. A vaporized deposition material may retain a ‘skin’ of unmelted material protecting the crucible from corrosion or contamination in highly reactive materials.

Angstrom Engineering incorporates electron beam deposition into systems providing advanced beam sweep pattern control for the most difficult applications. Systems can be configured using our standard platform designs or custom designed to meet your specific requirements.

Available on these systems:
Nexdep | Åmod | EvoVac | Custom