Glove Box Vacuum Coating

This Design Includes:

• Up to eleven (11) thermal resistive source boats, two (2) magnetron sputter sources or one (1) multi pocket electron beam heated source.
• 1500 l/s low profile cryogenic pumping package.
• Co-deposition source control using crystal sensor rate controllers and Sigma Instruments deposition control software.
• Four (4) port glove box integrated to a box style high vacuum chamber.
• Sliding front vacuum chamber door and a hinged rear access maintenance door.  Front glove box to vacuum chamber door allows two handed access to all vacuum coating components within the chamber.
• A built in standard nineteen (19) inch electrical rack to house the systems computer in addition to other rack mountable components.
• Fully automated PLC system control allowing automated or manual vacuum pump down, venting and cryo pump regeneration cycles.
• Two sets of deposition debris shielding to minimize vacuum chamber evaporated material build up.
• A magnetic manipulator transfer arm may be attached to the system with an optional vacuum load lock or substrate mask parking stage to introduce deposition substrates or masks without breaking vacuum.

Glove Box Products Information

The glove box thin film deposition systems shown throughout the images on this page were designed for research and development involving OLED organic light emitting diode, OTFT organic thin film transistor, and MEMS micro electro mechanical systems moisture barrier encapsulation layer research.  These display technologies require long term protection from the air which carries a high content of water moisture and oxygen.

Our glove box vacuum coating systems may be easily adapted for a variety of leading edge research fields including but not limited to OLED organic light emitting diodes, a-Si PV amorphous silicon photovoltaics, TFT-LCD thin film transistor liquid crystal displays, LTPS low temperature poly silicon, CG-Silicon continuous grain silicon and other mobile display device technology research.

Stainless steel cover panels are mounted in each frame section to safely enclose the system.  Panel safety interlocks prevent use of the deposition system controls while any of the panels are removed.

The machine interface shown to the right operates through a windows based PC personal computer controlling a PLC programmable logic controller which automates vacuum chamber and cryogenic pump down, venting sequences and any necessary regeneration cycles.

Angstrom Engineering thin film vacuum coating equipment uses Sigma Instruments software for deposition rate control and co deposition process applications.

The substrate stage housing included with our glove box vacuum deposition equipment can be easily modified and upgraded with substrate heaters to achieve direct sample heating substrate temperatures of up to six hundred (600) degrees Celsius or eleven hundred (1100) degrees Fahrenheit.

Every sample stage comes with continuous rotation capability and variable speed control.

The substrate shutter provided will block deposition material for a wide range of substrate wafer diameters or custom glass substrate shapes and sizes.

Our glove box high vacuum chamber is designed for future upgrades such as a linear motion vacuum load lock transfer mechanism to connect multiple thin film deposition systems, or a substrate shadow mask vacuum transfer load lock to increase research flexibility and decrease thin film deposition process time.

A glove box system integrated with a high vacuum chamber improves vacuum pump down times dramatically.  High vacuum chamber components are not exposed as frequently to atmosphere and their surfaces have a reduced water content allowing the deposition chamber to reach common vacuum process pressure in less than fifteen (15) minutes.

Vacuum base pressure in our cryo pumped glove box thin film deposition system is less than 5.0E-8 Torr with elastomer sealed vacuum doors and can be improved upon with alternate vacuum pumping if required.

Each thin film deposition glove box product can be custom modified to meet your vacuum deposition source requirements.  Deposition source arrangements of solely thermal resistive evaporation, magnetron sputtering, or electron beam heated sources are all an option, in addition to combinations of each deposition source selection.

Deposition source combinations include up to five (5) thermal evaporation sources, with up to two (2) magnetron sputter sources or a 6kW to 10kW multi pocket electron beam gun.

Each thermal resistive source boat has an individually supplied high power vacuum feedthrough with a shared return water cooled high current vacuum feedthrough.  This configuration allows the deposition system to operate a resistive source co deposition process in conjunction with either a magnetron sputtering process or an electron beam evaporation process.

Optional individual deposition source shutters may be provided, and can be activated separately.

Source isolation shielding is provided between each PVD physical vapor deposition source that also acts as a radiant heat shield.

Optional resistance evaporation source electrical clamp extensions may be purchased to adapt the system to various sized deposition sources.  Boat flexibility allows the system to be easily used for both organic material evaporation and metal evaporation or metallization depending on your research application.