NEXDEP

Offering custom flexibility in a compact footprint at an economical price, our Nexdep system can be built to meet your needs. Whether your process requires resistive evaporation, sputter deposition or electron beam evaporation, the Nexdep is highly capable. Its large hinged front door makes working with and cleaning the machine incredibly easy.

Process capabilities: resistive thermal evaporation | sputter deposition | electron beam evaporation | ion assisted deposition | custom available

OVERVIEW


OVERVIEW

  • 400mm x 475mm tall D-shaped chamber with large hinged front door
  • Aluminum or stainless steel chamber options
  • Custom designed to meet your process requirements
  • Support for multiple PVD processes
  • 600mm x 1000mm system footprint
  • International input voltages available
  • Recipe based advanced multi-layer deposition control with user logon control
  • Sequential or co-deposition
  • Standard fixturing supports up to 200mm diameter please contact us for assistance with larger substrate sizes
  • Factory training included with every system
  • Our detailed training manual teaches new users how to operate and maintain the equipment
  • User safety is held paramount with features such as cutting power to sources when the chamber is open
  • 1-year warranty with responsive and caring customer service

VACUUM CONTROL


VACUUM CONTROL

  • Automated single button pump down and venting sequences
  • Rotary vane or dry scroll rough pump options
  • High vacuum provided by turbo pump
  • Pneumatic air line filter prevents unwanted debris from reaching and damaging critical components
  • Easy access system interior with hinged electrical panel

DEPOSITION CONTROL


DEPOSITION CONTROL

  • Shadow Mask and substrate alignment fixturing is available
  • Sensors are rigidly mounted to ensure calibration is maintained
  • In co-deposition configurations QCM sensors are carefully isolated to ensure there is no interference from adjacent source material
  • Stainless steel isolation shields help to protect sources from cross contamination
  • Substrate heating, cooling and biasing available
  • Planetary motion available