RESISTIVE THERMAL EVAPORATION

Resistive evaporation is a commonly used vacuum deposition process in which electrical energy is used to heat a filament which in turn heats a deposition material to the point of evaporation. The process can be performed at very high levels of vacuum allowing for a long mean free path and therefore fewer tendencies to introduce film impurities. High deposition rates can be achieved and lower energy particles can reduce substrate damage.

Angstrom Engineering has developed thin film deposition systems based on this technique which can deposit a wide range of materials including metals, organic, and inorganic polymers. The process can be controlled using quartz rate sensor, temperature, or optical monitoring systems to ensure consistent high-quality results.

Available on these systems:
Covap II | Nexdep | Åmod | EvoVac | Custom