Magnetron Sputter Deposition
This Design Includes:
- Up to a quantity of three four inch (3x4in) diameter magnetron source locations are provided with integrated source shutter mechanisms and an adjustable source angle of plus or minus thirty (30) degrees.
- Each magnetron sputtering source location can accommodate a two (2), three (3), or four (4) inch diameter sputter source.
- 1500 l/s low profile cryogenic pumping package.
- Co-deposition sputter source control using Sigma Instruments deposition software and a variety of radio frequency RF and direct current DC power supply options.
- Down stream partial pressure gas control using a VAT throttling gate valve and several mass flow controller MFC units depending on the gas requirements for the system.
- Electronic vacuum flange hoists allowing a user to raise and lower the main system flanges for quick and easy access to the interior of the vacuum chamber.
- A built in standard nineteen (19) inch electrical rack to house the systems computer in addition to sputtering power supplies and other rack mountable components.
- Fully automated PLC system control allowing automated or manual vacuum pump down, venting and cryo pump regeneration cycles.
- Two sets of deposition debris shielding to minimize vacuum chamber sputtered material build up.
- A magnetic manipulator transfer arm may be attached to the system with an optional vacuum load lock to introduce deposition substrates without breaking vacuum.
Magnetron Sputtering Products
The magnetron sputter deposition system shown throughout the images on this page was designed for research and development involving photovoltaic and optoelectronic materials and devices.
Our magnetron sputtering system may be easily adapted for a variety of leading edge research fields including organic light emitting diodes (OLED), flat panel displays, solar panels, photovoltaics, nanotechnology, materials science and much more.
Stainless steel cover panels are mounted in each frame section to safely enclose the magnetron sputtering system. Panel safety interlocks prevent use of the deposition system controls while any of the panels are removed.
The substrate stage assembly shown to the right includes a single axis linear manipulator to adjust sputter source to substrate distance while also being used to connect substrates to the stage after transfer through a vacuum load lock.
The housing included with the transfer stage can be easily modified and upgraded with substrate heaters to achieve direct sample heating temperatures of up to six hundred (600) degrees Celsius or eleven hundred (1100) degrees Fahrenheit.
Every sample stage comes with continuous rotation capability and variable speed control.
Vacuum flange hoists may be rotated in either direction to allow increased access to the vacuum chamber interior.
Vacuum base pressure in our cryo pumped sputter vacuum system is less than 5.0E-8 Torr with elastomer sealed vacuum flanges and can be improved upon with alternate pumping or a metal vacuum flange sealing system.
Optional integrated magnetron source shutters may be provided in addition to or in substitution of a substrate shutter, all of which can be activated separately.
Isolation shielding is provided between each magnetron source that also acts to improve rate control when using individual crystal rate sensors.
Each sputter source can be raised and lowered independently as they mount to the vacuum flange through an ultratorr compression fitting. The source shutters telescope up and down to move with each magnetron source. Both items flex together so the sputter targets can be focused into a confocal sputter arrangement or aimed straight up.
Each sputter source crystal rate sensor is also mounted to the system using an ultratorr compression fitting and can be raised and lowered independent from the magnetron source assembly.