SPUTTER DEPOSITION

In sputtering, atoms are ejected from the surface of a target deposition material due to the impact of high energy particles contained in plasma. The ejected atoms condense on the surface of the substrate creating a thin film. Sputter deposition operates at higher pressures than evaporation lowering the mean free path and allowing reactions to take place. Sputtered films have stoichiometry that better represents the target material than does an evaporated film and certain processes will benefit from improved film adhesion due to higher impact energy. Sputter targets and sources can be sized to optimize rate, throughput, and film thickness uniformity.

Angstrom Engineering’s sputter deposition technology incorporates the highest quality sputter deposition sources integrated with a gas pressure control system allowing multi-gas inlets, high gas ratios, reactive gases, and more.

Sputter systems can be configured with RF, DC, pulsed DC, or MF power supplies.

Specifically configured sources make sputtering magnetic materials such as Fe, Ni and Co much easier and support an increase in target thickness.

Available on these systems:
Nexdep | Åmod | EvoVac | Custom