OUR TECH

Thin film deposition includes a number of technologies associated with growing layers of materials on a substrate with thicknesses that can range from less than 1 nm to several microns.  Our vacuum equipment is tailored by a team of engineers to meet each client’s needs and is capable of incorporating any of the following:

GLOVE BOX INTEGRATION
Allows PVD and non-PVD processes to be connected within a controlled environment.

RESISTIVE THERMAL EVAPORATION
Electrical energy is used to heat a filament, which in turn heats deposition material to the point of evaporation.

ELECTRON BEAM EVAPORATION
A filament emits a magnetically focused, high energy beam that is swept within a crucible of deposition material.

SPUTTER DEPOSITION
The impact of high energy particles contained in a plasma eject atoms from the surface of a target material, which then condense on the surface of the substrate to create a thin film.

ION ASSISTED DEPOSITION
A broad beam ion source directs a dispersed ion beam with a range of ion energies toward the substrate, typically along with a sputter or electron beam source.

PROCESS ENHANCEMENT TECHNOLOGIES
Each system can also be configured to offer substrate temperature control, biasing, planetary motion, and substrate cleaning.

SPACE/ENVIRONMENTAL SIMULATION
These chambers provide a high vacuum atmosphere along with a wide range of temperature control for testing components and assemblies to be used at high altitude or in space.